PECVD (plasma enhanced chemical vapor deposition system) platforms accommodate a range of substrate sizes to meet diverse application needs, with common dimensions including 50 mm x 50 mm, 100 mm x 100 mm, and 150 mm x 150 mm, as well as wafer sizes up to 6 inches. These systems are highly versatile, capable of depositing various materials like dielectrics, nitrides, and metals on substrates made of tungsten carbides, ceramics, and other compatible materials. Their adaptability to different substrate shapes and sizes makes them suitable for multiple industries, from semiconductor manufacturing to advanced material research.
Key Points Explained:
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Standard Substrate Sizes Supported
- PECVD systems typically support square substrates in the following dimensions:
- 50 mm × 50 mm
- 100 mm × 100 mm
- 150 mm × 150 mm
- For wafer-based applications, these systems can handle sizes up to 6 inches in diameter, catering to semiconductor fabrication needs.
- PECVD systems typically support square substrates in the following dimensions:
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Material Versatility of PECVD
- These systems deposit a wide array of materials, including:
- Dielectrics (e.g., SiO₂, Si₃N₄)
- Low-k dielectrics (e.g., SiOF, SiC)
- Nitrides (e.g., SiNₓ)
- Metals and hybrid structures
- The technology enables in-situ doping, enhancing functionality for specialized applications like optoelectronics or MEMS.
- These systems deposit a wide array of materials, including:
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Substrate Compatibility
- PECVD works with diverse substrate materials, such as:
- Tungsten carbides and tool steels (for wear-resistant coatings)
- High-temperature nickel alloys (for aerospace components)
- Ceramics and graphite (for thermal or electrical applications)
- The system adapts to flat, curved, or porous structures, ensuring uniform film deposition even on complex geometries.
- PECVD works with diverse substrate materials, such as:
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Applications Across Industries
- The flexibility in substrate size and material compatibility makes PECVD ideal for:
- Semiconductor device fabrication (e.g., silicon nitride passivation layers)
- Optical coatings (e.g., anti-reflective SiOx films)
- Protective coatings for industrial tools
- Its ability to deposit conformal, void-free films ensures high-quality results critical for advanced technologies.
- The flexibility in substrate size and material compatibility makes PECVD ideal for:
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Future-Readiness
- With support for 150 mm × 150 mm substrates and 6-inch wafers, PECVD systems align with trends toward larger-scale production and integration in next-generation devices.
- The technology’s adaptability to new materials (e.g., carbon-based layers) positions it as a cornerstone for emerging fields like flexible electronics or energy storage.
For more details on system capabilities, explore our resource on plasma enhanced chemical vapor deposition systems.
Summary Table:
| Feature | Details |
|---|---|
| Standard Substrate Sizes | 50 mm × 50 mm, 100 mm × 100 mm, 150 mm × 150 mm, and up to 6-inch wafers |
| Material Versatility | Dielectrics, nitrides, metals, and hybrid structures with in-situ doping |
| Substrate Compatibility | Tungsten carbides, ceramics, high-temperature alloys, and complex geometries |
| Key Applications | Semiconductor fabrication, optical coatings, protective industrial films |
| Future-Readiness | Supports emerging fields like flexible electronics and energy storage |
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