CVD & PECVD Furnace
Inclined Rotary Plasma Enhanced Chemical Deposition PECVD Tube Furnace Machine
Item Number : KT-PED
Price varies based on specs and customizations
- Heating temperature
- ≤800℃
- Vacuum degree
- ≤5×10-5Pa
- Output power
- 500W—1000W
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Plasma Enhanced Chemical Vapor Deposition (PECVD) Coating Machine


Advanced PECVD Systems by KINTEK: Precision Coating, Tailored to Your Needs
Leveraging exceptional R&D and in-house manufacturing, KINTEK delivers cutting-edge Plasma Enhanced Chemical Vapor Deposition (PECVD) systems designed for diverse laboratories and industrial applications. PECVD is a sophisticated vacuum thin film deposition technique that employs plasma to activate precursor gases. This allows for the creation of high-quality, uniform coatings at significantly lower temperatures than traditional Chemical Vapor Deposition (CVD), expanding the possibilities for heat-sensitive substrates (like plastics) and a diverse range of coating materials (including dielectrics, semiconductors, and insulators).
Our PECVD machines are a key offering within KINTEK's comprehensive suite of advanced high-temperature furnace solutions, which also includes Muffle, Tube, Rotary Furnaces, Vacuum & Atmosphere Furnaces, and other CVD/MPCVD Systems. We pride ourselves on our strong deep customization capability, ensuring that your PECVD system is precisely engineered to meet your unique experimental and production requirements.
Key Features
KINTEK's Plasma Enhanced Chemical Vapor Deposition (PECVD) Coating Machines offer a range of features designed for superior performance and versatility:
- Low-Temperature Deposition: Enables high-quality film formation on delicate or low melting point substrates without thermal damage, significantly broadening material compatibility.
- High Deposition Rates: Achieves rapid film growth, maximizing throughput, reducing processing time, and increasing overall productivity.
- Uniform and Crack-Resistant Films: Produces coatings with exceptional consistency in thickness and properties across the substrate, minimizing defects like cracking for reliable and durable results.
- Excellent Substrate Adhesion: Ensures strong bonding between the deposited film and the substrate material, leading to long-lasting performance and preventing delamination.
- Versatile Coating Capabilities: Supports deposition of a wide array of materials, such as SiO2, SiNx, SiOxNy, and more, catering to diverse application needs.
- Conformal Coating on Complex Geometries: Capable of uniformly coating substrates with intricate shapes and topographies, ensuring comprehensive coverage and optimal performance.
- User-Friendly Design: Engineered for low maintenance requirements and straightforward installation, minimizing downtime and simplifying integration into your workflow.
Technical Specifications
| Sample holder | Size | 1-6 inches |
| Rotate speed | 0-20rpm adjustable | |
| Heating temperature | ≤800℃ | |
| Control accuracy | ±0.5℃ SHIMADEN PID Controller | |
| Gas purge | Flow meter | MASS FLOWMETER CONTROLLER (MFC) |
| Channels | 4 channels | |
| Cooling method | Circulating water cooling | |
| Vacuum chamber | Chamber size | Φ500mm X 550mm |
| Observation port | Full view port with baffle | |
| Chamber material | 316 Stainless steel | |
| Door type | Front open type door | |
| Cap material | 304 Stainless steel | |
| Vacuum pump port | CF200 flange | |
| Gas inlet port | φ6 VCR connector | |
| Plasma power | Source power | DC power or RF power |
| Coupling mode | Inductively coupled or plate capacitive | |
| Output power | 500W—1000W | |
| Bias power | 500v | |
| Vacuum pump | Pre- pump | 15L/S Vane vacuum pump |
| Turbo pump port | CF150/CF200 620L/S-1600L/S | |
| Relief port | KF25 | |
| Pump speed | Vane pump:15L/s,Turbo pump:1200l/s或1600l/s | |
| Vacuum degree | ≤5×10-5Pa | |
| Vacuum sensor | Ionization/resistance vacuum gauge/film gauge | |
| System | Electric power supply | AC 220V /380 50Hz |
| Rated power | 5kW | |
| Dimensions | 900mm X 820mm X870mm | |
| Weight | 200kg |
Applications
Plasma Enhanced Chemical Vapor Deposition (PECVD) coating machines from KINTEK offer a versatile solution for a wide range of industries and cutting-edge applications:
- LED Lighting: Deposition of high-quality dielectric and semiconductor films crucial for efficient and durable light-emitting diodes (LEDs).
- Power Semiconductors: Formation of insulating layers, gate oxides, and other critical film components in power semiconductor devices.
- MEMS (Microelectromechanical Systems): Fabrication of precise thin films for sensors, actuators, and other micro-scale devices.
- Optical Coatings: Deposition of anti-reflection coatings, optical filters, protective layers, and other functional optical components.
- Thin Film Solar Cells: Production of amorphous and microcrystalline silicon thin films, as well as other semiconductor materials, for photovoltaic devices.
- Surface Modification: Enhancement of material surface properties, including improved corrosion resistance, wear resistance, hardness, and biocompatibility.
- Nanotechnology: Synthesis of advanced nanomaterials, such as nanoparticles, nanowires, and ultra-thin films for novel applications.
Why Partner with KINTEK for PECVD Technology?
Choosing KINTEK for your PECVD needs means investing in quality, reliability, and tailored solutions:
- Deep Customization: We specialize in configuring PECVD systems to your exact specifications, ensuring optimal performance for your unique applications and research goals.
- Advanced R&D and Manufacturing: Our in-house expertise drives innovation, allowing us to offer state-of-the-art PECVD technology.
- High-Quality Construction: Our systems feature rigid designs built with premium materials like stainless steel for stability, durability, and extended working life.
- Reliable Performance: Engineered for consistent results, our PECVD machines produce high-quality, uniform thin films with excellent adhesion.
- Comprehensive Support: From easy installation to low maintenance requirements, we ensure our systems are user-friendly and backed by responsive customer service.
- Versatility: Our machines can deposit a wide array of materials, making them suitable for diverse research and industrial processes.
Working Principle
Plasma Enhanced Chemical Vapor Deposition (PECVD) is a process that utilizes plasma (an ionized gas) to stimulate and enhance chemical reactions during the thin film deposition process. Unlike conventional CVD which relies solely on high temperatures to drive reactions, PECVD employs high-energy plasma. This plasma energizes the precursor gases, leading to the formation of reactive species at significantly lower substrate temperatures. These reactive species then adsorb onto the substrate surface and undergo chemical reactions to form a solid, thin film. This method allows for the deposition of various high-quality films, such as SiO2, SiNx, and SiOxNy, and is particularly effective for creating amorphous or microcrystalline silicon thin films used in solar cells. The lower processing temperatures minimize thermal stress on substrates, reduce pinholes, and prevent cracking, making PECVD ideal for a broader range of materials and applications.
Customize Your PECVD Solution with KINTEK
Ready to elevate your thin film deposition capabilities? KINTEK’s experts are on hand to discuss your specific project needs and challenges. We can help you configure a Plasma Enhanced Chemical Vapor Deposition system perfectly tailored to your experimental or production requirements. Benefit from our deep customization expertise and advanced technology to achieve superior results.
Contact us today to explore your custom PECVD solution!
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Product Datasheet
Inclined Rotary Plasma Enhanced Chemical Deposition PECVD Tube Furnace Machine
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