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RF PECVD System Radio Frequency Plasma Enhanced Chemical Vapor Deposition

CVD & PECVD Furnace

RF PECVD System Radio Frequency Plasma Enhanced Chemical Vapor Deposition

Item Number : KT-RFPE

Price varies based on specs and customizations

RF Power
0-2000W
Ultimate Vacuum
2×10-4 Pa
Chamber Dimensions
Ф420mm × 400 mm
ISO & CE icon

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Visual Showcase: RF PECVD System in Detail

rf pecvd system
RF PECVD System
RF PECVD thin film growing
RF PECVD Thin Film Growing
RF PECVD coating test 1
RF PECVD Coating Example
RF PECVD coating
RF PECVD Coating Result

Unlock Precision Thin-Film Deposition with KINTEK's RF PECVD Systems

KINTEK's Radio Frequency Plasma-Enhanced Chemical Vapor Deposition (RF PECVD) systems empower diverse laboratories to achieve cutting-edge thin-film deposition. This versatile technique utilizes plasma to precisely deposit a wide array of materials, including metals, dielectrics, and semiconductors, with exceptional control over film thickness, composition, and morphology. Leveraging our exceptional R&D and in-house manufacturing, we deliver advanced RF PECVD solutions tailored to your unique experimental requirements.

Key Applications of RF PECVD

RF-PECVD, a revolutionary technique in the realm of thin-film deposition, finds widespread applications in diverse industries, including:

  • Fabrication of optical components and devices
  • Manufacturing of semiconductor devices
  • Production of protective coatings
  • Development of microelectronics and MEMS
  • Synthesis of novel materials

Experience Unmatched Control and Efficiency

Our RF PECVD systems are designed to maximize your research outcomes and production efficiency:

Key Features:

  • Automated Operation: Simplify your workflow with one-button coating, and process storage and retrieval for consistent, repeatable results.
  • Intelligent Control: Benefit from comprehensive process operation logging, proactive alarm functions, and precise signal/valve switching for optimized deposition cycles.
  • Reliable Performance: Robust system design including a high-integrity vacuum chamber, efficient pumping system, stable RF source, and precision gas mixing system ensures dependable, long-term operation.

Core Advantages:

  • Superior Film Quality: Achieve high-quality film deposition, even at low temperatures suitable for temperature-sensitive substrates.
  • Precision & Uniformity: Benefit from precise control over film thickness and composition, with uniform and conformal deposition on complex geometries.
  • Clean & Efficient Processing: Experience low particle contamination and high purity films. Our systems are designed as an environmentally friendly process with minimal hazardous waste generation.
  • Scalable Solutions: KINTEK's RF PECVD systems are designed for both advanced research and scalable, cost-effective high-volume production.

Robust System Design for Optimal Performance

Our RF PECVD systems are meticulously engineered, comprising a high-vacuum chamber, an efficient vacuum pumping system, precisely controlled cathode and anode targets, a stable RF power source, an advanced inflatable gas mixing system, and a user-friendly computer control cabinet system. This integrated design enables seamless one-button coating, process storage and retrieval, alarm functions, signal and valve switching, comprehensive process operation logging, and reliable deposition of high-quality thin films, such as Diamond-like Carbon (DLC) films on germanium and silicon substrates for applications in the 3-12µm infrared wavelength range.

Technical Specifications

Main equipment part

Equipment form
  • Box type: the horizontal top cover opens the door, and the deposition chamber and the exhaust chamber are integrally welded;
  • The whole machine: the main engine and the electric control cabinet are integrated design (the vacuum chamber is on the left, and the electric control cabinet is on the right).
Vacuum chamber
  • Dimensions: Ф420mm (diameter) × 400 mm (height); made of 0Cr18Ni9 high-quality SUS304 stainless steel, the inner surface is polished, fine workmanship is required without rough solder joints, and there are cooling water pipes on the chamber wall;
  • Air extraction port: Double-layer 304 stainless steel mesh with 20mm front and rear intervals, anti-fouling baffle on the high valve stem, and air equalization plate at the exhaust pipe mouth to prevent pollution;
  • Sealing and shielding method: the upper chamber door and the lower chamber are sealed by a sealing ring to seal the vacuum, and the stainless steel network tube is used outside to isolate the radio frequency source, shielding the harm caused by radio frequency signals to people;
  • Observation window: Two 120mm observation windows are installed on the front and side, and the anti-fouling glass is resistant to high temperature and radiation, which is convenient for observing the substrate;
  • Air flow mode: the left side of the chamber is pumped by the molecular pump, and the right side is the air inflated to form a convective working mode of charging and pumping to ensure that the gas flows evenly to the target surface and enters the plasma area to fully ionize and deposit the carbon film;
  • Chamber material: the vacuum chamber body and the exhaust port are made of 0Cr18Ni9 high-quality SUS304 stainless steel material, the top cover is made of high-purity aluminum to reduce the weight of the top.
Host skeleton
  • Made of section steel (material: Q235-A) , the chamber body and the electric control cabinet are integrated design.
Water cooling system
  • Pipeline: The main inlet and outlet water distribution pipes are made of stainless steel pipes;
  • Ball valve: All cooling components are supplied with water separately through 304 ball valves, and the water inlet and outlet pipes have color distinctions and corresponding signs, and the 304 ball valves for the water outlet pipes can be opened and closed separately; The target, RF power supply, chamber wall, etc. are equipped with water flow protection, and there is a water cut-off alarm to prevent the water pipe from being blocked. All water flow alarms are displayed on the industrial computer;
  • Water flow display: The lower target has water flow and temperature monitoring, and the temperature and water flow are displayed on the industrial computer ;
  • Cold and hot water temperature: when the film is deposited on the chamber wall, cold water is passed through 10-25 degrees to cool the water, and it is advanced when the chamber door is opened. Pass hot water 30-55 degrees warm water.
Control cabinet
  • Structure: vertical cabinets are adopted, the instrument installation cabinet is a 19-inch international standard control cabinet, and the other electrical component installation cabinet is a large panel structure with a rear door;
  • Panel: The main electrical components in the control cabinet are all selected from manufacturers that have passed CE certification or ISO9001 certification. Install a set of power sockets on the panel;
  • Connection method: the control cabinet and the host are in a conjoined structure, the left side is the room body, the right side is the control cabinet, and the lower part is equipped with a dedicated wire slot, high and low voltage, and the RF signal is separated and routed to reduce interference;
  • Low-voltage electrical: French Schneider air switch and contactor to ensure reliable power supply of equipment;
  • Sockets: Spare sockets and instrumentation sockets are installed in the control cabinet.

Vacuum system

Ultimate vacuum
  • Atmosphere to 2×10-4 Pa≤24 hours, (at room temperature, and the vacuum chamber is clean).
Restore vacuum time
  • Atmosphere to 3×10 -3 Pa≤15 min (at room temperature, and the vacuum chamber is clean, with baffles, umbrella stands, and no substrate).
Pressure rise rate
  • ≤1.0×10 -1 Pa/h
Vacuum system configuration
  • The composition of the pump set: backing pump BSV30 (Ningbo Boss) + Roots pump BSJ70 (Ningbo Boss) + molecular pump FF-160 (Beijing);
  • Pumping method: pumping with soft pumping device (to reduce the pollution to the substrate during pumping);
  • Pipe connection: the vacuum system pipe is made of 304 stainless steel, and the soft connection of the pipe is made of;
  • Metal bellows; each vacuum valve is a pneumatic valve;
  • Air suction port: In order to prevent the membrane material from polluting the molecular pump during the evaporation process and improve the pumping efficiency, a movable isolation plate that is easy to disassemble and clean is used between the air suction port of the chamber body and the working room.
Vacuum system measurement
  • Vacuum display: three lows and one high (3 groups of ZJ52 regulation + 1 group of ZJ27 regulation );
  • High-vacuum gauge: ZJ27 ionization gauge is installed on the top of the pumping chamber of the vacuum box near the working chamber, and the measuring range is 1.0×10 -1 Pa to 5.0×10 -5 Pa;
  • Low-vacuum gauges: one set of ZJ52 gauges is installed on the top of the pumping chamber of the vacuum box, and the other set is installed on the rough pumping pipe. The measuring range is 1.0×10 +5 Pa to 5.0×10 -1 Pa;
  • Working regulation: CDG025D-1 capacitive film gauge is installed on the chamber body, and the measuring range is 1.33×10 -1 Pa to 1.33×10 +2 Pa, vacuum detection during deposition and coating, used in conjunction with constant vacuum butterfly valve use.
Vacuum system operation There are two modes of vacuum manual and vacuum automatic selection;
  • Japan Omron PLC controls all the pumps, the action of the vacuum valve, and the interlocking relationship between the work of the inflation stop valve to ensure that the equipment can be automatically protected in case of misoperation;
  • High valve, low valve, pre-valve, high valve bypass valve, in-position signal is sent to PLC control signal to ensure more comprehensive interlock function;
  • The PLC program can carry out the alarm function of each fault point of the whole machine, such as air pressure, water flow, door signal, over-current protection signal, etc. and alarm, so that the problem can be found quickly and conveniently;
  • The 15-inch touch screen is the upper computer, and the PLC is the lower computer monitoring and control valve. Online monitoring of each component and various signals are sent back to the industrial control configuration software in time for analysis and judgment, and recorded ;
  • When the vacuum is abnormal or the power is cut off, the molecular pump of the vacuum valve should return to the closed state. The vacuum valve is equipped with an interlock protection function, and the air inlet of each cylinder is equipped with a cut-off valve adjustment device, and there is a position set the sensor to display the closed state of the cylinder;
Vacuum test
  • According to the general technical conditions of GB11164 vacuum coating machine.

Heating system

  • Heating method: iodine tungsten lamp heating method;
  • Power regulator: digital power regulator;
  • Heating temperature: maximum temperature 200°C, power 2000W/220V, controllable and adjustable display, ±2°C control;
  • Connection method: fast insertion and quick retrieval, metal shielding cover for anti-fouling, and isolated power supply source to ensure the safety of personnel.

RF radio frequency power supply

  • Frequency: RF frequency 13.56MHZ;
  • Power: 0-2000W continuously adjustable;
  • Function: fully automatic impedance matching function adjustment, fully automatic adjustment to keep the reflection function very low working, internal reflection within 0.5% , with manual and automatic conversion adjustment function;
  • Display: with bias voltage, CT capacitor position, RT capacitor position, set power, reflective function display , with communication function, communicate with touch screen, set and display parameters on configuration software, tune line display etc.

Cathode anode target

  • Anode target: φ300mm copper substrate is used as the cathode target, the temperature is low when working, and no cooling water is needed;
  • Cathode target: φ200mm copper water-cooled cathode target, the temperature is high when working, and the interior is cooled water, to ensure consistent temperature during work, the maximum distance between the anode and the cathode target is 100-250mm.

Inflation control

  • Flowmeter: Four-way British flowmeter is used, the flow rate is 0-200SCCM, with pressure display, communication setting parameters, and gas type can be set;
  • Stop valve: Qixing Huachuang DJ2C-VUG6 stop valve, works with the flow meter, mixes the gas, fills it into the chamber through the annular inflation device, and flows evenly through the target surface;
  • Pre-stage gas storage bottle: mainly a flushing conversion bottle, which vaporizes the C4H10 liquid, and then enters the front-stage pipeline of the flowmeter. The gas storage bottle has a pressure digital display DSP instrument, which performs pressure over pressure and low pressure alarm prompts;
  • Mixed gas buffer bottle: The buffer bottle is mixed with four gases in the latter stage. After mixing, it is output from the buffer bottle all the way to the bottom of the chamber and all the way to the top, and one of them can be closed independently;
  • Inflating device: the uniform gas pipeline at the outlet of the gas circuit of the chamber body, which is evenly charged to the target surface to make the coating uniform is better.

Control system

  • Touch screen: take TPC1570GI touch screen as host computer + keyboard and mouse;
  • Control software: tabular process parameter setting, alarm parameter display, vacuum parameter display and curve display, RF power supply and DC direct current power supply parameter setting and display, all valve and switch working state records, process records, alarm records, vacuum record parameters , can be stored for about half a year, and the process operation of the whole equipment is saved in 1 second to save the parameters;
  • PLC: Omron PLC is used as the lower computer to collect data of various components and in-position switches, control valves and various components, and then perform data interaction, display and control with configuration software. This is more secure and reliable;
  • Control status: one-button coating, automatic vacuuming, automatic constant vacuum, automatic heating, automatic multi-layer process deposition, automatic completion of pick-up and other work;
  • Advantages of touch screen: touch screen control software cannot be changed, stable operation is more convenient and flexible, but the amount of stored data is limited, parameters can be directly exported, and when there is a problem with the process;
  • Alarm: adopt the sound and light alarm mode, and record the alarm in the configuration alarm parameter library. It can be queried at any time in the future, and the saved data can be queried and called at any time.

Constant vacuum

  • Butterfly valve constant vacuum: DN80 butterfly valve cooperates with Inficon CDG025 capacitive film gauge to work constant vacuum, the disadvantage is that the valve port is easy to be polluted and difficult to clean;
  • Valve Position Mode: Set the position control mode.

Water, electricity, gas

  • The main inlet and outlet pipes are made of stainless steel and equipped with emergency water inlets;
  • All water-cooled pipes outside the vacuum chamber adopt stainless steel quick-change fixed joints and plastic high-pressure ( High-quality water pipes, which can be used for a long time without leaking or breaking), and the water inlet and outlet plastic high-pressure water pipes should be displayed in two different colors and correspondingly marked; brand Airtek;
  • All water-cooled tubes inside the vacuum chamber are made of high-quality SUS304 material;
  • The water and gas circuits are respectively installed with safe and reliable, high-precision display water pressure and air pressure instruments .
  • Equipped with 8P chiller for water flow of carbon film machine.
  • Equipped with a set of 6KW hot water machine, when the door is opened, hot water will flow through the room.

Security protection requirements

  • The machine is equipped with an alarm device;
  • When the water pressure or air pressure does not reach the specified flow rate, all vacuum pumps and valves are protected and cannot be started, and an alarm sound and red signal light prompt;
  • When the machine is in normal working process, when the water pressure or air pressure is suddenly insufficient, all valves will be automatically closed, and an alarm sound and red signal light will appear;
  • When the operating system is abnormal (high voltage, ion source, control system), there will be an alarm sound and a red signal light prompt;
  • The high voltage is turned on, and there is a protection alarm device.

Working environment requirements

  • Ambient temperature: 10～35℃;
  • Relative humidity: not more than 80%;
  • The environment around the equipment is clean and the air is clean. There should be no dust or gas that can cause corrosion of electrical appliances and other metal surfaces or cause electrical conduction between metals.

Equipment power requirements

  • Water source: industrial soft water, water pressure 0.2~0.3Mpa, water volume~60L/min , water inlet temperature≤25°C; water pipe connection 1.5 inches;
  • Air source: air pressure 0.6MPa;
  • Power supply: three-phase five-wire system 380V, 50Hz, voltage fluctuation range: line voltage 342 ~ 399V, phase voltage 198 ~ 231V; frequency fluctuation range: 49 ~ 51Hz; equipment power consumption: ~ 16KW; grounding resistance ≤ 1Ω;
  • Hoisting requirements: self-provided 3-ton crane, hoisting door not less than 2000X2200mm

Ready to Advance Your Research? Partner with KINTEK.

At KINTEK, we understand that every experiment is unique. Our strong deep customization capability allows us to tailor our RF PECVD systems to your specific requirements. Whether you need modifications to standard models or a completely bespoke solution, our R&D and manufacturing expertise ensures you get the perfect fit for your laboratory.

Discuss your project with our experts today. Fill out our Contact Form, and let's explore how KINTEK can elevate your thin-film deposition capabilities.

FAQ

What Is The Principle Of An MPCVD Machine?

An MPCVD (Microwave Plasma Chemical Vapor Deposition) machine operates by using a microwave generator to produce plasma by ionizing a gas mixture. This plasma is housed in a reaction chamber under low pressure, where the substrate is held in place by a substrate holder. The key components include a Microwave Generator, Plasma Chamber, Gas Delivery System, Substrate Holder, and Vacuum System.

What Is A PECVD Machine Used For?

A PECVD (Plasma Enhanced Chemical Vapor Deposition) machine is extensively used in silicon and similar material processing, nanotechnology, solar cell production, and electronics. It is crucial for depositing thin films in solar cells and creating high-quality components for electronic devices. Applications include electronic device fabrication (isolation of conductive layers, capacitors, surface passivation), semiconductor devices, printable electronics, and medical device protection.

What Is The Principle Of A CVD Machine?

The principle of Chemical Vapor Deposition (CVD) involves introducing the vapor of gaseous or liquid reactants containing film elements and other necessary gases into a reaction chamber. By applying energy in the form of increased temperature, plasma action, light radiation, or other means, chemical reactions occur on the substrate surface, generating new solid substances that deposit as thin films. The working principle of a CVD furnace involves introducing precursor gases into the furnace chamber, where high temperatures cause these gases to react or decompose near the substrate surface. The desired material deposits on the substrate as a solid film, while by-products and unused gases are evacuated through an exhaust or vacuum system.

What Are The Advantages Of Using An MPCVD Machine?

MPCVD machines offer several advantages: they eliminate contamination from hot wires (non-polar discharge), allow the use of multiple gases, provide stable control of reaction temperature, enable large-area stable discharge plasma, and offer precise control over film thickness, purity, and crystal quality. Additionally, they produce large-area diamond films, ensure stable conditions, maintain consistent sample quality, and are cost-effective.

What Are The Main Types Of PECVD Machines?

PECVD machines come in various types, including Inclined Rotary Plasma Enhanced Chemical Deposition PECVD Tube Furnace Machines, Split Chamber CVD Tube Furnaces with Vacuum Stations, RF PECVD Systems, and Cylindrical Resonator MPCVD Machine Systems. Each type is designed for specific applications such as semiconductor research, thin-film deposition, and lab diamond growth.

What Are The Advantages Of Using A CVD Machine?

CVD provides high purity, uniformity, and conformality, making it suitable for coating complex geometries. It is used in industries like semiconductor, aerospace, and biomedical. Unlike PVD, CVD is not limited to line-of-sight application, and the coating bonds to the surface during the reaction, creating superior adhesion.

What Are The Key Applications Of MPCVD Machines?

MPCVD machines are primarily used for high-purity lab-grown diamond synthesis, including diamond films and other advanced materials. Their applications extend to semiconductor research, optics, and MEMS (Micro-Electro-Mechanical Systems) due to their ability to produce high-quality, homogeneous films with precise control.

How Does A PECVD Machine Work?

A PECVD machine works by using plasma to enhance the chemical vapor deposition process. Deposition rates and film properties (e.g., thickness, hardness, refractive index) are controlled by adjusting parameters such as gas flow rates, operating temperatures, and plasma conditions. The plasma allows for fine-tuning of material properties like density, purity, and roughness, enabling the creation of high-quality thin films at lower substrate temperatures.

What Are The Applications Of A CVD Machine?

CVD is used in various applications, including semiconductor device production (e.g., silicon nitride insulating layers), optical coatings, protective coatings, and advanced materials like graphene and carbon nanotubes, which have unique electrical, thermal, and mechanical properties. It is also used to deposit conformal films and modify substrate surfaces in ways traditional techniques cannot. Applications include atomic layer deposition, integrated circuits, photovoltaic devices, wear-resistant coatings, polymer coatings with special properties, metal-organic frameworks for gas sensing, and membrane coatings for water treatment.

What Are The Main Components Of An MPCVD Machine?

The main components of an MPCVD machine include a microwave generator (to produce plasma), a reaction chamber (to house the substrate and gas mixture under low pressure), a substrate holder (to hold the substrate during deposition), a gas delivery system (to introduce and control the gas mixture), and a vacuum system (to maintain the necessary low-pressure environment).

What Are The Key Features Of A PECVD Machine?

Key features of a PECVD machine include a universal base console housing electronic subsystems, a PECVD process chamber with a pumping port, heated upper and lower electrodes, parameter ramping software, and a gas pod with mass-flow-controlled gas lines. The system typically includes a chamber, vacuum pump(s), and a gas distribution system, with configurations varying based on power source, gas type, and pressure sensors.

What Are The Key Features Of A CVD Machine?

Key features of a CVD furnace include high temperature capability (typically ranging from 200°C to over 1500°C), precise gas flow control, atmosphere control (vacuum, atmospheric pressure, or low-pressure environments), uniform heating for even thin-film deposition, and an efficient exhaust system to remove by-products and unreacted gases. Key characteristics of a CVD coating process include application at elevated temperatures to facilitate the reaction, typically under vacuum. Contaminants must be removed from the part surface before coating.

How Does An MPCVD Machine Enhance Energy Efficiency?

An MPCVD machine enhances energy efficiency through its electrode-less process, which reduces contamination and energy loss. The microwave plasma generation is highly efficient, and the system's modular and scalable design allows for optimized energy use across various industrial applications.

What Are The Advantages Of Using A PECVD Machine?

PECVD machines offer several advantages, including rapid deposition rates (e.g., 160 times faster for silicon nitride compared to CVD), the ability to create films with different properties by adjusting plasma parameters and gas composition, high-quality and uniform thickness films, good adhesion, reduced risk of cracking, and suitability for complex surfaces. They also provide high solvent and corrosion resistance with chemical and thermal stability.

What Types Of CVD Machines Are Available?

There are several types of CVD machines available, including Cylindrical Resonator MPCVD Machine Systems for lab diamond growth, Custom Made Versatile CVD Tube Furnaces for chemical vapor deposition, Slide PECVD Tube Furnaces with liquid gasifiers, Vacuum Hot Press Furnace Machines, Inclined Rotary Plasma Enhanced Chemical Deposition (PECVD) Tube Furnaces, Split Chamber CVD Tube Furnaces with Vacuum Stations, and RF PECVD Systems for radio frequency plasma enhanced chemical vapor deposition. Each type is designed for specific applications and offers unique features.

Why Is MPCVD Preferred For Diamond Growth?

MPCVD is preferred for diamond growth because it provides a high density of charged particles and reactive species, enables deposition of large-area diamond films at lower pressures, and ensures better homogeneity in the as-grown films. These features result in high-purity, high-quality diamonds with precise control over their properties.

What Materials Can Be Deposited Using A PECVD Machine?

PECVD machines can deposit a variety of materials, including silicon nitride (SiN) and silicon carbide (SiC), which are particularly useful in semiconductor and high-temperature MEMS applications. These machines are versatile and can be used to create thin films with tailored properties for specific industrial and research needs.

Why Is PECVD Preferred Over Other Deposition Methods?

PECVD is preferred over other deposition methods because it allows for deposition at lower substrate temperatures, provides good step coverage, and enables highly uniform film deposition. It also offers excellent control over material properties such as refractive index, stress, and hardness, making it ideal for applications requiring precise thin-film characteristics.
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4.9

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5

Incredible precision and speed! This system has revolutionized our lab's efficiency.

Elara Voss

4.8

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5

Top-notch quality and durability. Worth every penny for advanced research.

Rafael Mendoza

4.7

out of

5

Fast delivery and easy setup. The technology is cutting-edge and reliable.

Sienna Kaur

4.9

out of

5

Exceptional value for money. The system performs flawlessly under heavy use.

Nikolai Petrov

4.8

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5

Highly advanced and user-friendly. A game-changer for our semiconductor work.

Ananya Desai

4.7

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5

Impressive durability and performance. Exceeded all our expectations.

Lucien Dubois

4.9

out of

5

The system arrived ahead of schedule and works like a dream. Perfect for high-tech labs.

Zara Al-Mansoori

4.8

out of

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Precision engineering at its best. This PECVD system is a must-have for serious researchers.

Hiroshi Tanaka

4.7

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Reliable and efficient. The technology is ahead of its time.

Freya Olsen

4.9

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Outstanding performance and quick delivery. Our lab couldn't be happier.

Mateo Silva

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Superior quality and advanced features. A fantastic investment for any lab.

Aisha Nkosi

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